Join the CHASM Preferred Integration Partner Program

The CHASM Preferred Integration Partner (PIP) Program assembles an exclusive network of the most prolific design, integration, and manufacturing organizations in the printed electronics industry.  The program connects end-customers across all industries seeking to innovate new products integrating transparent flexible printed electronics with select business partners having the expertise to quickly make them a reality at scale.  Participating partners can experience revenue growth offering CHASM’s CNT hybrid platform to existing clients and can expand market penetration through unique application offerings to new clients.  

The top 5 reasons to become a PIP member:

  1. Exclusive products offering your customers a new class of TCF having unrivaled price/performance - The ITO Alternative
  2. Grow your business with 2 proven go-to-market strategies: Up-sell existing clients and land new clients
  3. Full range of success enablement programs, tools, and resources to expedite results
  4. Concierge technical support including "CHASM University" for hands on learning in our state-of-the-art facility
  5. Actively promote your company's unique value proposition to a new audience

JOIN NOW!

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PIP Member Benefits

  • Dedicated CHASM strategic relationship manager
  • Member-specific sales and technical training including joint sales calls
  • Priority access to CHASM executives
  • Marketing support & co-marketing opportunities for improved sales funnels
  • Early visibility to CHASM product/IP roadmap and ability to shape direction for PIP member’s benefit
  • Referral opportunities when providing a capability for a customer’s specific needs
  • More ...

Requirements

Membership in the CHASM Preferred Integration Partner Program is offered exclusively to companies not just having an established customer base for flexible printed electronics but also those demonstrating leading expertise at integrating flexible printed electronics into finished product or electronic assemblies.